اختبار قوة الانحناء رقاقة السيليكون

حديثاً, تلقى آندي لي عينات رقاقة السيليكون من العملاء وتحتاج إلى اختبار قوتهم الانحناء. To meet the customer’s testing needs, وقام الفريق الفني للقياس والتحكم في VTS بتطوير مجموعة من الحلول التقنية لها. وشمل ذلك معدات وطرق الاختبار.

Silicon wafer bending strength testing Test Principle

The principle of the silicon wafer bending strength test is to apply a gradually increasing bending load to the sample. بالقيام بذلك, we can determine the maximum bending stress it can withstand before breaking. Consequently, this process allows us to evaluate the material’s fracture resistance and structural stability.

Test related standards

Tests were conducted based on the reference standard GB/T 15615-1995 “Test method for bending strength of silicon wafers”

Testing equipment

1. VTS – WDW- 5KN universal material testing machine

2. Protective cover

Since the silicon wafer will break due to stress during the test and produce flying fragments, the protective cover can effectively isolate these fragments to prevent harm to personnel.

3. 3-point bend test

4. Thickness gauge

5. شروط الاختبار

Sample name: silicon wafer

درجة حرارة الاختبار: درجة حرارة الغرفة

نوع الاختبار: three-point bending

سرعة الاختبار: 0.508مم/دقيقة

رابعا. عملية الاختبار

إعداد عينة

Before the experiment begins, cut the silicon wafer into a shape that meets the test requirements, clean and dry it, and ensure that there is no contaminant on the surface of the sample to obtain accurate test results.

Measure the thickness and width of the sample

Use a thickness gauge with an accuracy of 1 micron to measure the thickness and width of each sample silicon wafer to ensure data consistency.

Thickness measurement: Measure the thickness of the silicon wafer, with an average value of 0.775mm.

Length measurement: Measure the length of the silicon wafer, with an average value of 40mm.

Width measurement: Measure the width of the silicon wafer, with an average value of 20mm.

Equipment and fixture preparation

أولاً, install the test equipment by using the VTS-WDW-5 universal material testing machine. بالإضافة إلى ذلك, install a protective cover to ensure safe operation. The protective cover can effectively isolate the fragments splashed by the fracture during the test, thereby avoiding harm to personnel.

التالي, install the three-point bending fixture on the test machine. Ensure that the fixture position is accurate and meets the requirements of the silicon wafer bending test.

تحديد حالة الاختبار

Set the test machine parameters and test according to the following conditions:

Sample name: silicon wafer

درجة حرارة الاختبار: درجة حرارة الغرفة

نوع الاختبار: three-point bending

سرعة الاختبار: 0.508مم/دقيقة

Start the experiment

Place the silicon wafer sample on the three-point bending fixture, start the test machine to apply bending force at a preset speed, and record the bending strength data of the silicon wafer.

Data recording and analysis

أولاً, record the maximum bending stress and related data that the silicon wafer withstands before breaking. Subsequently, organize and analyze this data. أخيراً, evaluate the bending strength performance of the silicon wafer material.